Blog
Planify news
RRP Electronics signs MoU with Deca Technologies to acquire wafer-level chip packaging capability
    • RRP Electronics signs MoU with Deca Technologies to acquire wafer-level chip packaging capability

    26 February 2025

    Image

    Stay Connected, Stay Informed –

    Join Our

    WhatsApp

    Channel!

    Don’t miss out on exclusive updates, market trends, and real-time investment opportunities. Be the first to know about the latest unlisted stocks, IPO announcements, and curated Fact Sheets, delivered straight to your WhatsApp.