Polymatech Electronics IPO: India’s Chip Story Goes Public

Polymatech Electronics IPO: India’s Chip Story Goes Public
Lovely Baghel
Author

Lovely Baghel

Executive Digital Marketer

Digital Marketer

Publish Date19 January 2026
Reading time2 Min

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Pre IPO


India’s semiconductor ecosystem is slowly shifting from being import-dependent to homegrown manufacturing, and Polymatech Electronics Ltd. is emerging as one of the most compelling pieces of that puzzle. 


The company widely regarded as India’s first opto-semiconductor chip maker is preparing for a mega IPO of around ₹10,000 crore, with its Draft Red Herring Prospectus expected to be filed in 2026. This marks a significant leap from its earlier proposed ₹750 crore offer, reflecting its ambitious expansion plans and capital needs. 


Founded in 2018 with an initial investment of just ₹14 crore, Polymatech’s growth has been rapid. Its global manufacturing footprint spans advanced packaging and testing in India and Singapore, PCB fabrication in Estonia and ingot/wafers production in France, with assembly in Bahrain, all supporting diversified revenue streams.


Earlier projections saw Polymatech targeting $2.5 billion (~₹20,000 crore) revenue by FY26 on the back of expanded chip capacity and an order book reportedly worth ~₹7,000 crore, mostly exports.


Capex and Future Drivers


The optics of a ₹10,000 crore IPO in the semiconductor space especially one focused on opto-semiconductors and next-generation chips is noteworthy for several reasons:


Strategic positioning in chips, Global production base, and Tech differentiation.


  • A key milestone for the company is its GaN semiconductor plant in Nava Raipur, Chhattisgarh, backed by a ₹1,143 crore investment. This facility is poised to produce next-generation Gallium Nitride chips for 5G and future 6G networks, aligning with India’s technology and telecom ambitions. 
  • Beyond domestic capacity, Polymatech has also commissioned a €100 million PCB facility in Estonia, enabling high-density boards for telecom, aerospace, automotive and defence applications, a strategic move toward end-to-end electronics manufacturing.

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